Parallel three-dimensional free-space optical interconnection for an optoelectronic processor

Guoqiang Li, Dawei Huang, Emel Yuceturk, Sadik Esener, Volkan H. Ozguz, Yue Liu

Research output: Contribution to journalArticle

Abstract

A hybrid scalable optoelectronic crossbar switching system that uses global parallel free-space optical interconnects and three-dimensional (3D) VLSI chip stacks is presented. The system includes three 3D chip stacks with each consisting of 16 VLSI chips. A single 16 × 16 VCSEL/MSM detector array is flip-chip bonded on top of the chip stack. Each chip supports 16 optical I/Os at 1 Gb/s. For the free-space optical interconnection between the chip stacks, a novel folded hybrid micro/macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, large field of view, high link efficiency, and low optical crosstalk. It is also symmetric and modular. Off-the-shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks. The optical system is analyzed based on ray-tracing and scalar diffraction theory. The impact of Ghost talk on high-speed optical interconnection is studied. For system packaging, only passive alignment is required. Optics and electronics are separated until final assembly step, and the optomechanic module can be removed and replaced. By using 3D chip stacks, commercially available optical components and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.

Original languageEnglish (US)
Pages (from-to)19-29
Number of pages11
JournalUnknown Journal
Volume4470
DOIs
StatePublished - 2001
Externally publishedYes

Fingerprint

Optical Devices
Optical interconnects
Optoelectronic devices
central processing units
Switching systems
chips
Optical systems
Macros
Optics
Packaging
Mirrors
Product Packaging
Surface emitting lasers
Optical resolving power
Ray tracing
Crosstalk
Image quality
Telecommunication links
Electronic equipment
Diffraction

Keywords

  • 3D VLSI
  • Optical interconnection
  • Optical switching
  • Optoelectronic processing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Parallel three-dimensional free-space optical interconnection for an optoelectronic processor. / Li, Guoqiang; Huang, Dawei; Yuceturk, Emel; Esener, Sadik; Ozguz, Volkan H.; Liu, Yue.

In: Unknown Journal, Vol. 4470, 2001, p. 19-29.

Research output: Contribution to journalArticle

Li, Guoqiang ; Huang, Dawei ; Yuceturk, Emel ; Esener, Sadik ; Ozguz, Volkan H. ; Liu, Yue. / Parallel three-dimensional free-space optical interconnection for an optoelectronic processor. In: Unknown Journal. 2001 ; Vol. 4470. pp. 19-29.
@article{e33f4795a1ff4610993344b893351921,
title = "Parallel three-dimensional free-space optical interconnection for an optoelectronic processor",
abstract = "A hybrid scalable optoelectronic crossbar switching system that uses global parallel free-space optical interconnects and three-dimensional (3D) VLSI chip stacks is presented. The system includes three 3D chip stacks with each consisting of 16 VLSI chips. A single 16 × 16 VCSEL/MSM detector array is flip-chip bonded on top of the chip stack. Each chip supports 16 optical I/Os at 1 Gb/s. For the free-space optical interconnection between the chip stacks, a novel folded hybrid micro/macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, large field of view, high link efficiency, and low optical crosstalk. It is also symmetric and modular. Off-the-shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks. The optical system is analyzed based on ray-tracing and scalar diffraction theory. The impact of Ghost talk on high-speed optical interconnection is studied. For system packaging, only passive alignment is required. Optics and electronics are separated until final assembly step, and the optomechanic module can be removed and replaced. By using 3D chip stacks, commercially available optical components and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.",
keywords = "3D VLSI, Optical interconnection, Optical switching, Optoelectronic processing",
author = "Guoqiang Li and Dawei Huang and Emel Yuceturk and Sadik Esener and Ozguz, {Volkan H.} and Yue Liu",
year = "2001",
doi = "10.1117/12.449665",
language = "English (US)",
volume = "4470",
pages = "19--29",
journal = "Indian Journal of Rheumatology",
issn = "0973-3698",
publisher = "Elsevier (Singapore) Pte Ltd",

}

TY - JOUR

T1 - Parallel three-dimensional free-space optical interconnection for an optoelectronic processor

AU - Li, Guoqiang

AU - Huang, Dawei

AU - Yuceturk, Emel

AU - Esener, Sadik

AU - Ozguz, Volkan H.

AU - Liu, Yue

PY - 2001

Y1 - 2001

N2 - A hybrid scalable optoelectronic crossbar switching system that uses global parallel free-space optical interconnects and three-dimensional (3D) VLSI chip stacks is presented. The system includes three 3D chip stacks with each consisting of 16 VLSI chips. A single 16 × 16 VCSEL/MSM detector array is flip-chip bonded on top of the chip stack. Each chip supports 16 optical I/Os at 1 Gb/s. For the free-space optical interconnection between the chip stacks, a novel folded hybrid micro/macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, large field of view, high link efficiency, and low optical crosstalk. It is also symmetric and modular. Off-the-shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks. The optical system is analyzed based on ray-tracing and scalar diffraction theory. The impact of Ghost talk on high-speed optical interconnection is studied. For system packaging, only passive alignment is required. Optics and electronics are separated until final assembly step, and the optomechanic module can be removed and replaced. By using 3D chip stacks, commercially available optical components and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.

AB - A hybrid scalable optoelectronic crossbar switching system that uses global parallel free-space optical interconnects and three-dimensional (3D) VLSI chip stacks is presented. The system includes three 3D chip stacks with each consisting of 16 VLSI chips. A single 16 × 16 VCSEL/MSM detector array is flip-chip bonded on top of the chip stack. Each chip supports 16 optical I/Os at 1 Gb/s. For the free-space optical interconnection between the chip stacks, a novel folded hybrid micro/macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, large field of view, high link efficiency, and low optical crosstalk. It is also symmetric and modular. Off-the-shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks. The optical system is analyzed based on ray-tracing and scalar diffraction theory. The impact of Ghost talk on high-speed optical interconnection is studied. For system packaging, only passive alignment is required. Optics and electronics are separated until final assembly step, and the optomechanic module can be removed and replaced. By using 3D chip stacks, commercially available optical components and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.

KW - 3D VLSI

KW - Optical interconnection

KW - Optical switching

KW - Optoelectronic processing

UR - http://www.scopus.com/inward/record.url?scp=0035765504&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035765504&partnerID=8YFLogxK

U2 - 10.1117/12.449665

DO - 10.1117/12.449665

M3 - Article

AN - SCOPUS:0035765504

VL - 4470

SP - 19

EP - 29

JO - Indian Journal of Rheumatology

JF - Indian Journal of Rheumatology

SN - 0973-3698

ER -