Packaging issues for free space optically interconnected multiprocessors

Volkan H. Ozguz, Sadik C. Esener, Sing H. Lee

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

The technical feasibility and the performance of packaged systems with free space optical interconnections, for parallel computing, are analyzed. System issues such as volume, power consumption, optical properties of interconnection elements, yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

Original languageEnglish (US)
Pages (from-to)477-488
Number of pages12
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1390
DOIs
StatePublished - Apr 1 1991
Externally publishedYes
EventMicroelectronic Interconnects and Packages: System and Process Integration 1990 - Boston, United States
Duration: Nov 4 1990Nov 9 1990

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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