Packaging issues for free space optically interconnected multiprocessors

Volkan H. Ozguz; Sadik C. Esener; Sing H. Lee

doi:10.1117/12.25602

Packaging issues for free space optically interconnected multiprocessors

Volkan H. Ozguz, Sadik C. Esener, Sing H. Lee

Research output: Contribution to journal › Conference article › peer-review

3 Scopus citations

Abstract

The technical feasibility and the performance of packaged systems with free space optical interconnections, for parallel computing, are analyzed. System issues such as volume, power consumption, optical properties of interconnection elements, yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

Original language	English (US)
Pages (from-to)	477-488
Number of pages	12
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	1390
DOIs	https://doi.org/10.1117/12.25602
State	Published - Apr 1 1991
Externally published	Yes
Event	Microelectronic Interconnects and Packages: System and Process Integration 1990 - Boston, United States Duration: Nov 4 1990 → Nov 9 1990

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.25602

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@article{2bb9602e8c844a5984063db5aae8c272,

title = "Packaging issues for free space optically interconnected multiprocessors",

abstract = "The technical feasibility and the performance of packaged systems with free space optical interconnections, for parallel computing, are analyzed. System issues such as volume, power consumption, optical properties of interconnection elements, yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.",

author = "Ozguz, {Volkan H.} and Esener, {Sadik C.} and Lee, {Sing H.}",

note = "Publisher Copyright: {\textcopyright} 1991 SPIE. All rights reserved.; Microelectronic Interconnects and Packages: System and Process Integration 1990 ; Conference date: 04-11-1990 Through 09-11-1990",

year = "1991",

month = apr,

day = "1",

doi = "10.1117/12.25602",

language = "English (US)",

volume = "1390",

pages = "477--488",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

}

TY - JOUR

T1 - Packaging issues for free space optically interconnected multiprocessors

AU - Ozguz, Volkan H.

AU - Esener, Sadik C.

AU - Lee, Sing H.

PY - 1991/4/1

Y1 - 1991/4/1

N2 - The technical feasibility and the performance of packaged systems with free space optical interconnections, for parallel computing, are analyzed. System issues such as volume, power consumption, optical properties of interconnection elements, yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

AB - The technical feasibility and the performance of packaged systems with free space optical interconnections, for parallel computing, are analyzed. System issues such as volume, power consumption, optical properties of interconnection elements, yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

UR - http://www.scopus.com/inward/record.url?scp=0025722306&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025722306&partnerID=8YFLogxK

U2 - 10.1117/12.25602

DO - 10.1117/12.25602

M3 - Conference article

AN - SCOPUS:0025722306

SN - 0277-786X

VL - 1390

SP - 477

EP - 488

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Microelectronic Interconnects and Packages: System and Process Integration 1990

Y2 - 4 November 1990 through 9 November 1990

ER -

Packaging issues for free space optically interconnected multiprocessors

Abstract

ASJC Scopus subject areas

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