Numerical modeling of transport and accumulation of DNA on electronically active biochips

Samuel K. Kassegne, Howard Reese, Dalibor Hodko, Joon M. Yang, Kamal Sarkar, Dan Smolko, Paul Swanson, Daniel E. Raymond, Michael J. Heller, Marc J. Madou

Research output: Contribution to journalArticlepeer-review

47 Scopus citations

Abstract

Transport and accumulation of biomolecules, particularly DNA, in active electronic chips are investigated through numerical modeling and experimental verification. Various geometric and design configurations of electronically active DNA chips are considered. Further, we investigate the effect of electric field distribution on practical design of flow cells and chips. Particular attention is focused on the geometric effects on current and electric field distribution which are well captured by a finite element method-based model. We demonstrate that these geometric effects are observed only in buffers of very low conductivity. We also demonstrate that numerical models which do not include the charge transfer mechanism between electrodes and the buffer solution will fail to predict the reduction of these geometric effects with increased buffer conductivity. The review of the technology is based on computer simulation using a finite element-based computational model and experimental results of electric field distribution, DNA transport and accumulation. Comparison of theoretical results for electrophoretic DNA accumulation with those obtained from experiments and a simple analytical model is presented.

Original languageEnglish (US)
Pages (from-to)81-98
Number of pages18
JournalSensors and Actuators, B: Chemical
Volume94
Issue number1
DOIs
StatePublished - Aug 15 2003
Externally publishedYes

Keywords

  • Active electronic chip
  • DNA transport
  • Electrophoresis
  • Finite element analysis
  • Hybridization
  • Micro-electrodes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry

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