Interaction of nanoparticles at the DEP microelectrode interface under high conductance conditions

Rajaram Krishnan, Dietrich A. Dehlinger, Gregory J. Gemmen, Robert L. Mifflin, Sadik Esener, Michael (Mike) Heller

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

The separation of nanoparticles from micron size particles in high conductance buffers was achieved using an AC dielectrophoretic (DEP) microarray device with hydrogel over-coated microelectrodes. While nanoparticles could be selectively concentrated into high field regions directly over the platinum microelectrodes, micro-bubbling and electrode darkening was also observed. For similar experiments using un-coated microelectrodes, SEM analysis showed severe erosion of the platinum microelectrodes and fusion of nanoparticles due to the aggressive electrochemistry.

Original languageEnglish (US)
Pages (from-to)1661-1666
Number of pages6
JournalElectrochemistry Communications
Volume11
Issue number8
DOIs
StatePublished - Aug 2009
Externally publishedYes

Fingerprint

Microelectrodes
Nanoparticles
Platinum
Hydrogel
Electrochemistry
Microarrays
Hydrogels
Erosion
Buffers
Fusion reactions
Particle size
Scanning electron microscopy
Electrodes
Experiments

Keywords

  • Dielectrophoresis
  • Electrochemistry
  • High conductance
  • Microelectrodes
  • Nanoparticles

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Interaction of nanoparticles at the DEP microelectrode interface under high conductance conditions. / Krishnan, Rajaram; Dehlinger, Dietrich A.; Gemmen, Gregory J.; Mifflin, Robert L.; Esener, Sadik; Heller, Michael (Mike).

In: Electrochemistry Communications, Vol. 11, No. 8, 08.2009, p. 1661-1666.

Research output: Contribution to journalArticle

Krishnan, Rajaram ; Dehlinger, Dietrich A. ; Gemmen, Gregory J. ; Mifflin, Robert L. ; Esener, Sadik ; Heller, Michael (Mike). / Interaction of nanoparticles at the DEP microelectrode interface under high conductance conditions. In: Electrochemistry Communications. 2009 ; Vol. 11, No. 8. pp. 1661-1666.
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