Implementation and prospects for chip-to-chip free-space optical interconnects

Research output: Contribution to journalConference article

5 Scopus citations

Abstract

This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.

Original languageEnglish (US)
Pages (from-to)541-544
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
StatePublished - Dec 1 2001
Externally publishedYes
EventIEEE International Electron Devices Meeting IEDM 2001 - Washington, DC, United States
Duration: Dec 2 2001Dec 5 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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