Abstract
This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.
Original language | English (US) |
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Pages (from-to) | 541-544 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
State | Published - 2001 |
Externally published | Yes |
Event | IEEE International Electron Devices Meeting IEDM 2001 - Washington, DC, United States Duration: Dec 2 2001 → Dec 5 2001 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry