Implementation and prospects for chip-to-chip free-space optical interconnects

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.

Original languageEnglish (US)
Pages (from-to)541-544
Number of pages4
JournalUnknown Journal
StatePublished - 2001
Externally publishedYes

Fingerprint

Optical interconnects
Optical links
Product Packaging
Silicon
Printed circuit boards
Optoelectronic devices
Optics
Packaging
Lasers
Electronic equipment
Technology
Detectors
Costs and Cost Analysis
Equipment and Supplies
Communication
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Implementation and prospects for chip-to-chip free-space optical interconnects. / Esener, Sadik.

In: Unknown Journal, 2001, p. 541-544.

Research output: Contribution to journalArticle

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