Abstract
A fully packaged free space optical system (FSOI) for multi-chip interconnection is presented. By simply snapping the FSOI module on the optoelectronic module via mechanical pins, a plug and play like FSOI module is obtained. System characterization is performed by soldering the FSOI module onto a test PCB board. High speed parallel single hop, bi-directional chip to chip parallel and multi-hop interconnections are all demonstrated successfully. A single vertical cavity surface emitting lasers (VCSEL) to metal-semiconductor-metal link can operate at 400 Mbits/sec per channel, while the H-Spice simulation of the entire link show that the maximum speed of the system is 250 MHz.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 884-885 |
| Number of pages | 2 |
| Journal | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS |
| Volume | 2 |
| State | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 12th Annual Meeting IEEE Lasers and Electro-Optics Society (LEOS'99) - San Francisco, CA, USA Duration: Nov 8 1999 → Nov 11 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering