High speed parallel multi-chip interconnection with free space optics

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Sadik C. Esener

Research output: Contribution to journalConference article

1 Scopus citations

Abstract

A fully packaged free space optical system (FSOI) for multi-chip interconnection is presented. By simply snapping the FSOI module on the optoelectronic module via mechanical pins, a plug and play like FSOI module is obtained. System characterization is performed by soldering the FSOI module onto a test PCB board. High speed parallel single hop, bi-directional chip to chip parallel and multi-hop interconnections are all demonstrated successfully. A single vertical cavity surface emitting lasers (VCSEL) to metal-semiconductor-metal link can operate at 400 Mbits/sec per channel, while the H-Spice simulation of the entire link show that the maximum speed of the system is 250 MHz.

Original languageEnglish (US)
Pages (from-to)884-885
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume2
StatePublished - Dec 1 1999
Externally publishedYes
EventProceedings of the 1999 12th Annual Meeting IEEE Lasers and Electro-Optics Society (LEOS'99) - San Francisco, CA, USA
Duration: Nov 8 1999Nov 11 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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