High speed parallel multi-chip interconnection with free space optics

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Sadik Esener

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A fully packaged free space optical system (FSOI) for multi-chip interconnection is presented. By simply snapping the FSOI module on the optoelectronic module via mechanical pins, a plug and play like FSOI module is obtained. System characterization is performed by soldering the FSOI module onto a test PCB board. High speed parallel single hop, bi-directional chip to chip parallel and multi-hop interconnections are all demonstrated successfully. A single vertical cavity surface emitting lasers (VCSEL) to metal-semiconductor-metal link can operate at 400 Mbits/sec per channel, while the H-Spice simulation of the entire link show that the maximum speed of the system is 250 MHz.

Original languageEnglish (US)
Pages (from-to)884-885
Number of pages2
JournalUnknown Journal
Volume2
StatePublished - 1999
Externally publishedYes

Fingerprint

Space optics
Optical Devices
Optical systems
Humulus
Metals
Spices
Semiconductors
Polychlorinated Biphenyls
Soldering
Surface emitting lasers
Polychlorinated biphenyls
Optoelectronic devices
Lasers
Semiconductor materials

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

High speed parallel multi-chip interconnection with free space optics. / Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Esener, Sadik.

In: Unknown Journal, Vol. 2, 1999, p. 884-885.

Research output: Contribution to journalArticle

Zheng, X, Marchand, PJ, Huang, D & Esener, S 1999, 'High speed parallel multi-chip interconnection with free space optics', Unknown Journal, vol. 2, pp. 884-885.
Zheng, Xuezhe ; Marchand, Philippe J. ; Huang, Dawei ; Esener, Sadik. / High speed parallel multi-chip interconnection with free space optics. In: Unknown Journal. 1999 ; Vol. 2. pp. 884-885.
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