Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

Engineering & Materials Science

• Optical interconnects 100%
• Optoelectronic devices 87%
• Optics 78%
• Switching systems 59%
• Mirrors 51%
• Optomechanics 50%
• Metal detectors 40%
• Surface emitting lasers 35%
• Bandwidth 31%
• Optical systems 28%
• Image quality 23%
• Macros 22%
• Packaging 22%
• Electronic equipment 21%
• Demonstrations 20%
• Silicon 19%
• Metals 16%

Physics & Astronomy

• very large scale integration 90%
• central processing units 76%
• chips 59%
• modules 23%
• optical switching 20%
• optics 20%
• mirrors 13%
• bandwidth 13%
• surface emitting lasers 9%
• packaging 9%
• metals 9%
• misalignment 9%
• field of view 8%
• assembly 8%
• alignment 7%
• high speed 7%
• scaling 6%
• cavities 5%
• high resolution 5%
• shift 5%
• output 5%
• detectors 5%
• silicon 5%
• electronics 4%
• performance 4%