System architecture for use with free space optical interconnects in a 3D stacked processor environment

J. Rorie, P. Marchand, P. Chandramani, J. Ekman, F. Kiamilev, F. Zane, V. Ozguz, Sadik Esener

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

Stacking technology is an approach by which VLSI dies are stacked to form a three-dimensional logic unit. The free space optical interconnect is a technology suited for dealing with the unique constraints of three-dimensional stacked processors. The architecture supports the calculation of two dimensional fast Fourier transforms (FFT) and other signal processing functions using free space optical interconnects for communication between planes and stacks. Major architectural points are the development of reliable high-speed serial bus and an inter-processor communication protocol. This protocol must account for the unique requirements of the free space optical interconnects while maximizing the bandwidth available.

Original languageEnglish (US)
Pages (from-to)41-42
Number of pages2
JournalUnknown Journal
Publication statusPublished - 1998
Externally publishedYes

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

Cite this

Rorie, J., Marchand, P., Chandramani, P., Ekman, J., Kiamilev, F., Zane, F., ... Esener, S. (1998). System architecture for use with free space optical interconnects in a 3D stacked processor environment. Unknown Journal, 41-42.