System architecture for use with free space optical interconnects in a 3D stacked processor environment

J. Rorie, P. Marchand, P. Chandramani, J. Ekman, F. Kiamilev, F. Zane, V. Ozguz, S. C. Esener

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

Stacking technology is an approach by which VLSI dies are stacked to form a three-dimensional logic unit. The free space optical interconnect is a technology suited for dealing with the unique constraints of three-dimensional stacked processors. The architecture supports the calculation of two dimensional fast Fourier transforms (FFT) and other signal processing functions using free space optical interconnects for communication between planes and stacks. Major architectural points are the development of reliable high-speed serial bus and an inter-processor communication protocol. This protocol must account for the unique requirements of the free space optical interconnects while maximizing the bandwidth available.

Original languageEnglish (US)
Pages (from-to)41-42
Number of pages2
JournalLEOS Summer Topical Meeting
StatePublished - Jan 1 1998
Externally publishedYes
EventProceedings of the 1998 IEEE/LEOS Summer Topical Meeting - Monterey, CA, USA
Duration: Jul 20 1998Jul 24 1998

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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    Rorie, J., Marchand, P., Chandramani, P., Ekman, J., Kiamilev, F., Zane, F., Ozguz, V., & Esener, S. C. (1998). System architecture for use with free space optical interconnects in a 3D stacked processor environment. LEOS Summer Topical Meeting, 41-42.