Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies

Gökçe I. Yayla, Philippe J. Marchand, Sadik Esener

Research output: Contribution to journalArticle

85 Citations (Scopus)

Abstract

We model and compare on-chip (up to wafer scale) and off-chip (multichip module) high-speed electrical interconnections with free-space optical interconnections in terms of speed performance and energy requirements for digital transmission in large-scale systems. For all technologies the interconnections are first modeled and optimized for minimum delay as functions of the interconnection length for both one-to-one and fan-out connections. Then energy requirements are derived as functions of the interconnection length. Free-space optical interconnections that use multiple-quantum-well modulators or vertical-cavity surface-emitting lasers as transmitters are shown to offer a speed-energy product advantage as high as 30 over that of the electrical interconnection technologies.

Original languageEnglish (US)
Pages (from-to)205-227
Number of pages23
JournalApplied Optics
Volume37
Issue number2
StatePublished - 1998
Externally publishedYes

Fingerprint

Optical interconnects
chips
Multichip modules
energy requirements
Surface emitting lasers
Semiconductor quantum wells
Modulators
Fans
energy
Large scale systems
Transmitters
surface emitting lasers
fans
transmitters
modulators
modules
high speed
quantum wells
wafers
requirements

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Speed and energy analysis of digital interconnections : Comparison of on-chip, off-chip, and free-space technologies. / Yayla, Gökçe I.; Marchand, Philippe J.; Esener, Sadik.

In: Applied Optics, Vol. 37, No. 2, 1998, p. 205-227.

Research output: Contribution to journalArticle

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