TY - GEN
T1 - Reliability of 3D-printed dynamic scanners
AU - Gönültaś, Burak Mert
AU - Aygün, Sacid
AU - Khayatzadeh, Ramin
AU - Çivitci, Fehmi
AU - Gökdel, Yiǧit Daǧhan
AU - Yelten, Mustafa Berke
AU - Ferhanoǧlu, Onur
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/28
Y1 - 2017/7/28
N2 - 3D-printed dynamic structures have arisen as a lower cost and easier to fabricate alternative to miniaturized sensor and actuator technologies. Here, we investigate the reliability of a selected 3D-printed laser scanner, which was initially designed for miniaturized confocal imaging, having 1 x 1 cm2 footprint. The scan-line, 1st resonant frequency and quality factor of 3 devices were monitored for 100,000,000 (hundred million) cycles, and an average deviation of <6% was observed for all three parameters under investigation, for the devices under test. We conclude that 3D printed dynamic structures are promising candidates for a variety of applications, including optomedical imaging applications that demand disposable and low-cost scanning technologies.
AB - 3D-printed dynamic structures have arisen as a lower cost and easier to fabricate alternative to miniaturized sensor and actuator technologies. Here, we investigate the reliability of a selected 3D-printed laser scanner, which was initially designed for miniaturized confocal imaging, having 1 x 1 cm2 footprint. The scan-line, 1st resonant frequency and quality factor of 3 devices were monitored for 100,000,000 (hundred million) cycles, and an average deviation of <6% was observed for all three parameters under investigation, for the devices under test. We conclude that 3D printed dynamic structures are promising candidates for a variety of applications, including optomedical imaging applications that demand disposable and low-cost scanning technologies.
KW - 3D-printed scanner
KW - microscanner
KW - performance evaluation
KW - usability
UR - http://www.scopus.com/inward/record.url?scp=85028570009&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028570009&partnerID=8YFLogxK
U2 - 10.1109/IMS3TW.2017.7995204
DO - 10.1109/IMS3TW.2017.7995204
M3 - Conference contribution
AN - SCOPUS:85028570009
T3 - Proceedings of the 2017 IEEE 22nd International Mixed-Signals Test Workshop, IMSTW 2017
BT - Proceedings of the 2017 IEEE 22nd International Mixed-Signals Test Workshop, IMSTW 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE International Mixed-Signals Test Workshop, IMSTW 2017
Y2 - 3 July 2017 through 5 July 2017
ER -