Abstract
A free-space optoelectronic system with 90% link efficiency and better than -20 dB crosstalk is introduced. The system is scalable and could be easily used to accommodate 2D arrays of optoelectronic devices. With simple refinement, this packaging approach can be extended to 3D stacked electronic chips integrated with 2D transmitter and receiver array for dramatically increasing the number of silicon chips in the MCM.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 142-147 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3631 |
| State | Published - Jan 1 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III - San Jose, CA, USA Duration: Jan 28 1999 → Jan 29 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering