Packaging for 3D optoelectronic stacked processors

Philippe J. Marchand, Xuezhe Zheng, Dawei Huang, Volkan Ozguz, Sadik Esener

Research output: Contribution to journalArticle

Abstract

A free-space optoelectronic system with 90% link efficiency and better than -20 dB crosstalk is introduced. The system is scalable and could be easily used to accommodate 2D arrays of optoelectronic devices. With simple refinement, this packaging approach can be extended to 3D stacked electronic chips integrated with 2D transmitter and receiver array for dramatically increasing the number of silicon chips in the MCM.

Original languageEnglish (US)
Pages (from-to)142-147
Number of pages6
JournalUnknown Journal
Volume3631
StatePublished - 1999
Externally publishedYes

    Fingerprint

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Marchand, P. J., Zheng, X., Huang, D., Ozguz, V., & Esener, S. (1999). Packaging for 3D optoelectronic stacked processors. Unknown Journal, 3631, 142-147.