A free-space optoelectronic system with 90% link efficiency and better than -20 dB crosstalk is introduced. The system is scalable and could be easily used to accommodate 2D arrays of optoelectronic devices. With simple refinement, this packaging approach can be extended to 3D stacked electronic chips integrated with 2D transmitter and receiver array for dramatically increasing the number of silicon chips in the MCM.
|Original language||English (US)|
|Number of pages||6|
|State||Published - 1999|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics