Packaging for 3D optoelectronic stacked processors

Philippe J. Marchand, Xuezhe Zheng, Dawei Huang, Volkan Ozguz, Sadik Esener

Research output: Contribution to journalConference article

Abstract

A free-space optoelectronic system with 90% link efficiency and better than -20 dB crosstalk is introduced. The system is scalable and could be easily used to accommodate 2D arrays of optoelectronic devices. With simple refinement, this packaging approach can be extended to 3D stacked electronic chips integrated with 2D transmitter and receiver array for dramatically increasing the number of silicon chips in the MCM.

Original languageEnglish (US)
Pages (from-to)142-147
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3631
StatePublished - Jan 1 1999
Externally publishedYes
EventProceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III - San Jose, CA, USA
Duration: Jan 28 1999Jan 29 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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