Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Osman Kibar, Nur S E Ozkan, Sadik Esener

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

A proof of concept and a feasibility demonstration of a practical packaging approach is demonstrated in which free space optical interconnects (FSOI) can be integrated on electronic multichip modules (MCM) for intra-MCM-board interconnects. The system level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive assembly techniques to yield a potentially low cost and manufacturable packaging solution. All the chips are assembled on a single substrate that consists of a 1D array of 12 devices.

Original languageEnglish (US)
Pages (from-to)5631-5640
Number of pages10
JournalApplied Optics
Volume38
Issue number26
StatePublished - 1999
Externally publishedYes

Fingerprint

free-space optical interconnects
Optical interconnects
printed circuits
circuit boards
packaging
Printed circuit boards
Multichip modules
Packaging
electronic modules
electronic packaging
Electronics packaging
shelves
Imaging systems
Optics
Demonstrations
assembly
modules
chips
optics
Substrates

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Zheng, X., Marchand, P. J., Huang, D., Kibar, O., Ozkan, N. S. E., & Esener, S. (1999). Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package. Applied Optics, 38(26), 5631-5640.

Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package. / Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S E; Esener, Sadik.

In: Applied Optics, Vol. 38, No. 26, 1999, p. 5631-5640.

Research output: Contribution to journalArticle

Zheng, X, Marchand, PJ, Huang, D, Kibar, O, Ozkan, NSE & Esener, S 1999, 'Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package', Applied Optics, vol. 38, no. 26, pp. 5631-5640.
Zheng, Xuezhe ; Marchand, Philippe J. ; Huang, Dawei ; Kibar, Osman ; Ozkan, Nur S E ; Esener, Sadik. / Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package. In: Applied Optics. 1999 ; Vol. 38, No. 26. pp. 5631-5640.
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