Optical memory systems for 3-D computing architectures

Research output: Contribution to journalArticle

Abstract

Three-dimensional techniques are emerging to package many electronic chips in a single 3D assembly that can provide single chip like performance. Due to the inherent parallelism used in these packages, large I/O bandwidths are possible. A direct application of these techniques is the 3D DRAM stacks. 3D packaging allows for larger capacity memories to be built without incurring a significant increase in access times. Moreover, due to their dimensional compatibility, 3D memories and 3D packaged electronic processing systems may be naturally well suited to each other's needs. This paper explores the possibilities and attempts to outline means by which these devices can be interfaced advantageously.

Original languageEnglish (US)
Pages (from-to)261
Number of pages1
JournalUnknown Journal
Volume2
StatePublished - 1995
Externally publishedYes

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Optical data storage
Optical Devices
Data storage equipment
Dynamic random access storage
Product Packaging
Packaging
Bandwidth
Equipment and Supplies
Processing

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Optical memory systems for 3-D computing architectures. / Esener, Sadik.

In: Unknown Journal, Vol. 2, 1995, p. 261.

Research output: Contribution to journalArticle

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