Optical interconnects for silicon chip stacks

S. Esener; P. Marchand; F. Kiamilev; V. Ozguz; Y. Liu

Optical interconnects for silicon chip stacks

S. Esener, P. Marchand, F. Kiamilev, V. Ozguz, Y. Liu

Research output: Contribution to conference › Paper › peer-review

Abstract

Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

Original language	English (US)
Pages	1/-
State	Published - Dec 1 1999
Externally published	Yes
Event	InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA Duration: Jun 13 1999 → Jun 19 1999

Other

Other	InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
City	Maui, HI, USA
Period	6/13/99 → 6/19/99

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering

Cite this

@conference{91169a6c1eb542918abebf2a4b38b8a5,

title = "Optical interconnects for silicon chip stacks",

abstract = "Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.",

author = "S. Esener and P. Marchand and F. Kiamilev and V. Ozguz and Y. Liu",

year = "1999",

month = dec,

day = "1",

language = "English (US)",

pages = "1/--",

note = "InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' ; Conference date: 13-06-1999 Through 19-06-1999",

}

TY - CONF

T1 - Optical interconnects for silicon chip stacks

AU - Esener, S.

AU - Marchand, P.

AU - Kiamilev, F.

AU - Ozguz, V.

AU - Liu, Y.

PY - 1999/12/1

Y1 - 1999/12/1

N2 - Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

AB - Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

UR - http://www.scopus.com/inward/record.url?scp=0033333269&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033333269&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0033333269

SP - 1/-

T2 - InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'

Y2 - 13 June 1999 through 19 June 1999

ER -

Optical interconnects for silicon chip stacks

Abstract

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ASJC Scopus subject areas

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