Optical interconnects for silicon chip stacks

Sadik Esener, P. Marchand, F. Kiamilev, V. Ozguz, Y. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherASME
Volume26
StatePublished - 1999
Externally publishedYes
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: Jun 13 1999Jun 19 1999

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period6/13/996/19/99

    Fingerprint

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Esener, S., Marchand, P., Kiamilev, F., Ozguz, V., & Liu, Y. (1999). Optical interconnects for silicon chip stacks. In American Society of Mechanical Engineers, EEP (Vol. 26). ASME.