Abstract
Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.
| Original language | English (US) |
|---|---|
| Title of host publication | American Society of Mechanical Engineers, EEP |
| Publisher | ASME |
| Volume | 26 |
| State | Published - 1999 |
| Externally published | Yes |
| Event | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA Duration: Jun 13 1999 → Jun 19 1999 |
Other
| Other | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' |
|---|---|
| City | Maui, HI, USA |
| Period | 6/13/99 → 6/19/99 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
Cite this
Optical interconnects for silicon chip stacks. / Esener, Sadik; Marchand, P.; Kiamilev, F.; Ozguz, V.; Liu, Y.
American Society of Mechanical Engineers, EEP. Vol. 26 ASME, 1999.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Optical interconnects for silicon chip stacks
AU - Esener, Sadik
AU - Marchand, P.
AU - Kiamilev, F.
AU - Ozguz, V.
AU - Liu, Y.
PY - 1999
Y1 - 1999
N2 - Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.
AB - Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.
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UR - http://www.scopus.com/inward/citedby.url?scp=0033333269&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0033333269
VL - 26
BT - American Society of Mechanical Engineers, EEP
PB - ASME
ER -