Optical Interconnects for Silicon Chip Stacks

Sadik Esener, P. Marchand, F. Kiamilev, V. Ozguz, Y. Liu

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

Original languageEnglish (US)
Pages (from-to)925-929
Number of pages5
JournalUnknown Journal
Volume26 3
StatePublished - 1999
Externally publishedYes

Fingerprint

Optical interconnects
Product Packaging
Silicon
Equipment and Supplies
Multicarrier modulation
Research
Optoelectronic devices
Packaging
Processing
Direction compound

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Esener, S., Marchand, P., Kiamilev, F., Ozguz, V., & Liu, Y. (1999). Optical Interconnects for Silicon Chip Stacks. Unknown Journal, 26 3, 925-929.

Optical Interconnects for Silicon Chip Stacks. / Esener, Sadik; Marchand, P.; Kiamilev, F.; Ozguz, V.; Liu, Y.

In: Unknown Journal, Vol. 26 3, 1999, p. 925-929.

Research output: Contribution to journalArticle

Esener, S, Marchand, P, Kiamilev, F, Ozguz, V & Liu, Y 1999, 'Optical Interconnects for Silicon Chip Stacks', Unknown Journal, vol. 26 3, pp. 925-929.
Esener S, Marchand P, Kiamilev F, Ozguz V, Liu Y. Optical Interconnects for Silicon Chip Stacks. Unknown Journal. 1999;26 3:925-929.
Esener, Sadik ; Marchand, P. ; Kiamilev, F. ; Ozguz, V. ; Liu, Y. / Optical Interconnects for Silicon Chip Stacks. In: Unknown Journal. 1999 ; Vol. 26 3. pp. 925-929.
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