New optical and electric-field assisted fluidic pick and place technique

Mihrimah Ozkan, Osman Kibar, Cengiz S. Ozkan, Sadik Esener

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Electrophoresis is a classical electrochemical transport process, which is based on the migration of charged particles in a suspension by the influence of an electric field. One of the important applications of this technique is the study of DNA/RNA hybridization on bio-electronic chips. However, electrophoretic pick and place techniques are currently limited to the serial `pick' and `place' of individual devices or materials. There is a need for the rapid and parallel pick-and-place of individual devices to particular locations on a host substrate. In this paper, we present a novel electrochemical system for non-lithographic, field assisted, fluidic pick and place assembly of devices on a silicon substrate by means of electrical and optical addressing. The methodology presented here can be applied to massively parallel assembly of large semiconductor arrays (>1000×1000) with fast (approximately a few seconds) and accurate positioning for a wide range of device sizes (0.8-100 μm). In our experiments, an electrochemical cell was used with Indium Tin Oxide (ITO) and an n-type Silicon substrate as the two electrode materials and de-ionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. Negatively charged polystyrene beads (0.8 μm, 10 μm, and 20 μm in diameter), 50-100 μm diameter negatively charged (by immersing SDS detergent) SiO2 pucks and 100 μm diameter light emitting diodes were successfully positioned on Silicon substrates by electrical addressing. In addition, 0.8 μm diameter beads were patterned on a un-patterned Silicon substrate by optical addressing.

Original languageEnglish (US)
Pages (from-to)1021-1026
Number of pages6
JournalUnknown Journal
Volume4089
StatePublished - 2000
Externally publishedYes

Fingerprint

fluidics
Fluidics
Silicon
Electric fields
Equipment and Supplies
electric fields
Substrates
silicon
Electrodes
beads
Puck
Semiconductors
assembly
chips (electronics)
Polystyrenes
Detergents
Electrochemical cells
detergents
electrochemical cells
Electrophoresis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

New optical and electric-field assisted fluidic pick and place technique. / Ozkan, Mihrimah; Kibar, Osman; Ozkan, Cengiz S.; Esener, Sadik.

In: Unknown Journal, Vol. 4089, 2000, p. 1021-1026.

Research output: Contribution to journalArticle

Ozkan, M, Kibar, O, Ozkan, CS & Esener, S 2000, 'New optical and electric-field assisted fluidic pick and place technique', Unknown Journal, vol. 4089, pp. 1021-1026.
Ozkan, Mihrimah ; Kibar, Osman ; Ozkan, Cengiz S. ; Esener, Sadik. / New optical and electric-field assisted fluidic pick and place technique. In: Unknown Journal. 2000 ; Vol. 4089. pp. 1021-1026.
@article{1b877981f1d2447e9a65c394cbfb9366,
title = "New optical and electric-field assisted fluidic pick and place technique",
abstract = "Electrophoresis is a classical electrochemical transport process, which is based on the migration of charged particles in a suspension by the influence of an electric field. One of the important applications of this technique is the study of DNA/RNA hybridization on bio-electronic chips. However, electrophoretic pick and place techniques are currently limited to the serial `pick' and `place' of individual devices or materials. There is a need for the rapid and parallel pick-and-place of individual devices to particular locations on a host substrate. In this paper, we present a novel electrochemical system for non-lithographic, field assisted, fluidic pick and place assembly of devices on a silicon substrate by means of electrical and optical addressing. The methodology presented here can be applied to massively parallel assembly of large semiconductor arrays (>1000×1000) with fast (approximately a few seconds) and accurate positioning for a wide range of device sizes (0.8-100 μm). In our experiments, an electrochemical cell was used with Indium Tin Oxide (ITO) and an n-type Silicon substrate as the two electrode materials and de-ionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. Negatively charged polystyrene beads (0.8 μm, 10 μm, and 20 μm in diameter), 50-100 μm diameter negatively charged (by immersing SDS detergent) SiO2 pucks and 100 μm diameter light emitting diodes were successfully positioned on Silicon substrates by electrical addressing. In addition, 0.8 μm diameter beads were patterned on a un-patterned Silicon substrate by optical addressing.",
author = "Mihrimah Ozkan and Osman Kibar and Ozkan, {Cengiz S.} and Sadik Esener",
year = "2000",
language = "English (US)",
volume = "4089",
pages = "1021--1026",
journal = "Indian Journal of Rheumatology",
issn = "0973-3698",
publisher = "Elsevier (Singapore) Pte Ltd",

}

TY - JOUR

T1 - New optical and electric-field assisted fluidic pick and place technique

AU - Ozkan, Mihrimah

AU - Kibar, Osman

AU - Ozkan, Cengiz S.

AU - Esener, Sadik

PY - 2000

Y1 - 2000

N2 - Electrophoresis is a classical electrochemical transport process, which is based on the migration of charged particles in a suspension by the influence of an electric field. One of the important applications of this technique is the study of DNA/RNA hybridization on bio-electronic chips. However, electrophoretic pick and place techniques are currently limited to the serial `pick' and `place' of individual devices or materials. There is a need for the rapid and parallel pick-and-place of individual devices to particular locations on a host substrate. In this paper, we present a novel electrochemical system for non-lithographic, field assisted, fluidic pick and place assembly of devices on a silicon substrate by means of electrical and optical addressing. The methodology presented here can be applied to massively parallel assembly of large semiconductor arrays (>1000×1000) with fast (approximately a few seconds) and accurate positioning for a wide range of device sizes (0.8-100 μm). In our experiments, an electrochemical cell was used with Indium Tin Oxide (ITO) and an n-type Silicon substrate as the two electrode materials and de-ionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. Negatively charged polystyrene beads (0.8 μm, 10 μm, and 20 μm in diameter), 50-100 μm diameter negatively charged (by immersing SDS detergent) SiO2 pucks and 100 μm diameter light emitting diodes were successfully positioned on Silicon substrates by electrical addressing. In addition, 0.8 μm diameter beads were patterned on a un-patterned Silicon substrate by optical addressing.

AB - Electrophoresis is a classical electrochemical transport process, which is based on the migration of charged particles in a suspension by the influence of an electric field. One of the important applications of this technique is the study of DNA/RNA hybridization on bio-electronic chips. However, electrophoretic pick and place techniques are currently limited to the serial `pick' and `place' of individual devices or materials. There is a need for the rapid and parallel pick-and-place of individual devices to particular locations on a host substrate. In this paper, we present a novel electrochemical system for non-lithographic, field assisted, fluidic pick and place assembly of devices on a silicon substrate by means of electrical and optical addressing. The methodology presented here can be applied to massively parallel assembly of large semiconductor arrays (>1000×1000) with fast (approximately a few seconds) and accurate positioning for a wide range of device sizes (0.8-100 μm). In our experiments, an electrochemical cell was used with Indium Tin Oxide (ITO) and an n-type Silicon substrate as the two electrode materials and de-ionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. Negatively charged polystyrene beads (0.8 μm, 10 μm, and 20 μm in diameter), 50-100 μm diameter negatively charged (by immersing SDS detergent) SiO2 pucks and 100 μm diameter light emitting diodes were successfully positioned on Silicon substrates by electrical addressing. In addition, 0.8 μm diameter beads were patterned on a un-patterned Silicon substrate by optical addressing.

UR - http://www.scopus.com/inward/record.url?scp=0033690820&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033690820&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0033690820

VL - 4089

SP - 1021

EP - 1026

JO - Indian Journal of Rheumatology

JF - Indian Journal of Rheumatology

SN - 0973-3698

ER -