Modeling of endovascular patch welding using the computer program LATIS

Michael E. Glinsky, Richard A. London, George B. Zimmerman, Steven L. Jacques

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

A new computer program, LATIS, being developed at Lawrence Livermore National Laboratory is used to study the effect of pulsed laser irradiation on endovascular patch welding. Various physical and biophysical effects are included in these simulations: laser light scattering and absorption, tissue heating and heat conduction, vascular cooling, and tissue thermal damage. The geometry of a patch being held against the inner vessel wall (500 μm inner diameter) by a balloon is considered. The system is exposed to light pulsed from an optical fiber inside the balloon. A minimum in the depth of damage into the vessel wall is found. The minimum damage zone is about the thickness of the patch material that is heated by the laser. The more ordered the tissue the thinner the minimum zone of damage. The pulse length which minimizes the zone of damage is found to be the time for energy to diffuse across the layer. The delay time between the pulses is determined by the time for the heated layer to cool down. An optimal pulse length exists which minimizes the total time needed to weld the patch to the wall while keeping the thickness of the damaged tissue to less than 100 μm. For the case that is considered, a patch dyed with light absorbing ICG on the side next to the vessel (thickness of the dyed layer is 60 μm), the best protocol is found to be 65-200 ms pulses applied over 2 mm.

Original languageEnglish (US)
Pages (from-to)262-272
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume2391
DOIs
StatePublished - May 22 1995
EventLaser-Tissue Interaction VI 1995 - San Jose, United States
Duration: Feb 1 1995Feb 8 1995

Keywords

  • Endovascular
  • Laser
  • Patch
  • Simulation
  • Soldering
  • Stent
  • Welding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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