We describe a novel electrochemical technique for the nonlithographic, f luidic pick-and-place assembly of optoelectronic devices by electrical and optical addressing. An electrochemical cell was developed that consists of indium tin oxide (ITO) and n-type silicon substrates as the two electrode materials and deionized water (R = 18 MΩ) as the electrolytic medium between the two electrodes. 0.8-20-μm-diameter negatively charged polystyrene beads, 50-100-μm-diameter SiO2 pucks, and 50-μm LED's were successfully integrated upon a patterned silicon substrate by electrical addressing. In addition, 0.8-μ;m-diameter beads were integrated upon a homogeneous silicon substrate by optical addressing. This method can be applied to massively parallel assembly (>1000 X 1000 arrays) of multiple types of devices (of a wide size range) with very fast (a few seconds) and accurate positioning.
|Original language||English (US)|
|Number of pages||3|
|State||Published - Sep 1 2000|
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics