Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model

Yasmin Wadia, Hua Xie, Michio Kajitani, Kenton Gregory, Scott Prahl

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The purpose of this study was to evaluate laser soldering using liquid albumin for welding liver lacerations and sealing raw surfaces created by segmental resection of a lobe. Major liver trauma has a high mortality due to immediate exsanguination and a delayed morbidity and mortality from septicemia, peritonitis, biliary fistulae and delayed secondary hemorrhage. Eight laceration injuries (6 cm long×2 cm deep) and eight non-anatomical resection injuries (raw surface 6 cm×2 cm) were repaired. An 805 nm laser was used to weld 53% liquid albumin-ICG solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized to simulate coagulation failure and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, eight soldering repairs each were evaluated at three hours. A single suture repair of each type was evaluated at three hours. All 16 laser mediated liver repairs were accompanied by minimal blood loss as compared to the suture controls. No dehiscence, hemorrhage or bile leakage was seen in any of the laser repairs after three hours. In conclusion laser fusion repair of the liver is a quick and reliable technique to gain hemostasis on the cut surface as well as weld lacerations.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages74-81
Number of pages8
Volume3907
StatePublished - 2000
EventLasers in Surgery: Advanced Characterization, Therapeutics, and Systems X - San Jose, CA, USA
Duration: Jan 22 2000Jan 25 2000

Other

OtherLasers in Surgery: Advanced Characterization, Therapeutics, and Systems X
CitySan Jose, CA, USA
Period1/22/001/25/00

Fingerprint

hemorrhages
soldering
Soldering
albumins
liver
Liver
Repair
Lasers
Liquids
liquids
mortality
lasers
Welds
hemostatics
Laser fusion
laser fusion
occlusion
sealing
coagulation
Scaffolds (biology)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Wadia, Y., Xie, H., Kajitani, M., Gregory, K., & Prahl, S. (2000). Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3907, pp. 74-81). Society of Photo-Optical Instrumentation Engineers.

Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model. / Wadia, Yasmin; Xie, Hua; Kajitani, Michio; Gregory, Kenton; Prahl, Scott.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3907 Society of Photo-Optical Instrumentation Engineers, 2000. p. 74-81.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wadia, Y, Xie, H, Kajitani, M, Gregory, K & Prahl, S 2000, Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 3907, Society of Photo-Optical Instrumentation Engineers, pp. 74-81, Lasers in Surgery: Advanced Characterization, Therapeutics, and Systems X, San Jose, CA, USA, 1/22/00.
Wadia Y, Xie H, Kajitani M, Gregory K, Prahl S. Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3907. Society of Photo-Optical Instrumentation Engineers. 2000. p. 74-81
Wadia, Yasmin ; Xie, Hua ; Kajitani, Michio ; Gregory, Kenton ; Prahl, Scott. / Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3907 Society of Photo-Optical Instrumentation Engineers, 2000. pp. 74-81
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