High speed parallel multi-chip interconnection with free space optics

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Sadik Esener

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, a high-speed parallel data communication scheme is proposed for multi-chip interconnections. We present the proof of concept and feasibility demonstration of a practical module packaging approach where free-space optical interconnects can be seamlessly integrated on electronic Multi-Chip Modules (MCM) for intra MCM interconnects. Our system level packaging architecture is based on a modified folded 4-f imaging system that has been implemented using only off-the-shelf optics, conventional electronic packaging, as well as passive alignment and assembly techniques to yield a potentially low cost manufacturable packaging solution. The prototype system, as built, supports 48 independent FSOI channels using eight separate laser and detector chips, where each chip consists of a 1D array of 12 devices. All chips are assembled on a single ceramic substrate together with three silicon chips. Parallel opto-electronic free space interconnections have been demonstrated with link speeds of up to 200 MHz per channel. The system is compact at only 10 cubic inches, and scalable as it can easily accommodate additional chips as well as two-dimensional opto-electronic device arrays for increased interconnection density.

Original languageEnglish (US)
Title of host publicationProceedings - 6th International Conference on Parallel Interconnects, PI 1999
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages13-20
Number of pages8
ISBN (Electronic)076950440X, 9780769504407
DOIs
StatePublished - Jan 1 1999
Externally publishedYes
Event6th International Conference on Parallel Interconnects, PI 1999 - Anchorage, United States
Duration: Oct 17 1999Oct 19 1999

Other

Other6th International Conference on Parallel Interconnects, PI 1999
CountryUnited States
CityAnchorage
Period10/17/9910/19/99

Fingerprint

Space optics
Packaging
Electronics packaging
Optical interconnects
Imaging systems
Optoelectronic devices
Optics
Demonstrations
Detectors
Silicon
Lasers
Communication
Substrates
Costs

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture

Cite this

Zheng, X., Marchand, P. J., Huang, D., & Esener, S. (1999). High speed parallel multi-chip interconnection with free space optics. In Proceedings - 6th International Conference on Parallel Interconnects, PI 1999 (pp. 13-20). [806390] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PI.1999.806390

High speed parallel multi-chip interconnection with free space optics. / Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Esener, Sadik.

Proceedings - 6th International Conference on Parallel Interconnects, PI 1999. Institute of Electrical and Electronics Engineers Inc., 1999. p. 13-20 806390.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zheng, X, Marchand, PJ, Huang, D & Esener, S 1999, High speed parallel multi-chip interconnection with free space optics. in Proceedings - 6th International Conference on Parallel Interconnects, PI 1999., 806390, Institute of Electrical and Electronics Engineers Inc., pp. 13-20, 6th International Conference on Parallel Interconnects, PI 1999, Anchorage, United States, 10/17/99. https://doi.org/10.1109/PI.1999.806390
Zheng X, Marchand PJ, Huang D, Esener S. High speed parallel multi-chip interconnection with free space optics. In Proceedings - 6th International Conference on Parallel Interconnects, PI 1999. Institute of Electrical and Electronics Engineers Inc. 1999. p. 13-20. 806390 https://doi.org/10.1109/PI.1999.806390
Zheng, Xuezhe ; Marchand, Philippe J. ; Huang, Dawei ; Esener, Sadik. / High speed parallel multi-chip interconnection with free space optics. Proceedings - 6th International Conference on Parallel Interconnects, PI 1999. Institute of Electrical and Electronics Engineers Inc., 1999. pp. 13-20
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