Abstract
The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2-7 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3290 |
| DOIs | |
| State | Published - 1998 |
| Externally published | Yes |
| Event | Optoelectronic Integrated Circuits II - San Jose, CA, United States Duration: Jan 28 1998 → Jan 30 1998 |
Keywords
- Active-pixel sensor
- DNA hybridizing
- Epitaxial growth
- Epitaxial liftoff
- Flip-chip bonding
- Heterogeneous integration
- MQW modulator
- Optoelectronics
- Self-assembly
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering