Heterogeneous integration of optoelectronic components

Chi Fan, David W. Shih, Mark W. Hansen, Daniel Hartman, Daniel Van Blerkom, Sadik Esener, Michael (Mike) Heller

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.

Original languageEnglish (US)
Pages (from-to)2-7
Number of pages6
JournalUnknown Journal
Volume3290
DOIs
StatePublished - 1998
Externally publishedYes

Fingerprint

Silicon
Optoelectronic devices
Robotics
Self assembly
self assembly
Industry
Polymers
Substrates
chips
Technology
Light
Switching circuits
Equipment and Supplies
switching circuits
DNA
Sensor arrays
silicon
optical switching
light modulators
robotics

Keywords

  • Active-pixel sensor
  • DNA hybridizing
  • Epitaxial growth
  • Epitaxial liftoff
  • Flip-chip bonding
  • Heterogeneous integration
  • MQW modulator
  • Optoelectronics
  • Self-assembly

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Fan, C., Shih, D. W., Hansen, M. W., Hartman, D., Van Blerkom, D., Esener, S., & Heller, M. M. (1998). Heterogeneous integration of optoelectronic components. Unknown Journal, 3290, 2-7. https://doi.org/10.1117/12.298226

Heterogeneous integration of optoelectronic components. / Fan, Chi; Shih, David W.; Hansen, Mark W.; Hartman, Daniel; Van Blerkom, Daniel; Esener, Sadik; Heller, Michael (Mike).

In: Unknown Journal, Vol. 3290, 1998, p. 2-7.

Research output: Contribution to journalArticle

Fan, C, Shih, DW, Hansen, MW, Hartman, D, Van Blerkom, D, Esener, S & Heller, MM 1998, 'Heterogeneous integration of optoelectronic components', Unknown Journal, vol. 3290, pp. 2-7. https://doi.org/10.1117/12.298226
Fan C, Shih DW, Hansen MW, Hartman D, Van Blerkom D, Esener S et al. Heterogeneous integration of optoelectronic components. Unknown Journal. 1998;3290:2-7. https://doi.org/10.1117/12.298226
Fan, Chi ; Shih, David W. ; Hansen, Mark W. ; Hartman, Daniel ; Van Blerkom, Daniel ; Esener, Sadik ; Heller, Michael (Mike). / Heterogeneous integration of optoelectronic components. In: Unknown Journal. 1998 ; Vol. 3290. pp. 2-7.
@article{aa1dd987c7534c078ed5d8b8466dcdd8,
title = "Heterogeneous integration of optoelectronic components",
abstract = "The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.",
keywords = "Active-pixel sensor, DNA hybridizing, Epitaxial growth, Epitaxial liftoff, Flip-chip bonding, Heterogeneous integration, MQW modulator, Optoelectronics, Self-assembly",
author = "Chi Fan and Shih, {David W.} and Hansen, {Mark W.} and Daniel Hartman and {Van Blerkom}, Daniel and Sadik Esener and Heller, {Michael (Mike)}",
year = "1998",
doi = "10.1117/12.298226",
language = "English (US)",
volume = "3290",
pages = "2--7",
journal = "Indian Journal of Rheumatology",
issn = "0973-3698",
publisher = "Elsevier (Singapore) Pte Ltd",

}

TY - JOUR

T1 - Heterogeneous integration of optoelectronic components

AU - Fan, Chi

AU - Shih, David W.

AU - Hansen, Mark W.

AU - Hartman, Daniel

AU - Van Blerkom, Daniel

AU - Esener, Sadik

AU - Heller, Michael (Mike)

PY - 1998

Y1 - 1998

N2 - The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.

AB - The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.

KW - Active-pixel sensor

KW - DNA hybridizing

KW - Epitaxial growth

KW - Epitaxial liftoff

KW - Flip-chip bonding

KW - Heterogeneous integration

KW - MQW modulator

KW - Optoelectronics

KW - Self-assembly

UR - http://www.scopus.com/inward/record.url?scp=0032400681&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032400681&partnerID=8YFLogxK

U2 - 10.1117/12.298226

DO - 10.1117/12.298226

M3 - Article

AN - SCOPUS:0032400681

VL - 3290

SP - 2

EP - 7

JO - Indian Journal of Rheumatology

JF - Indian Journal of Rheumatology

SN - 0973-3698

ER -