Heterogeneous integration of optoelectronic components

Chi Fan, David W. Shih, Mark W. Hansen, Daniel Hartman, Daniel Van Blerkom, Sadik C. Esener, Michael Heller

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we will describe the results of oar monolithic integration effort involving a 2 × 2 optoelectronic switching circuit and an 8 × 8 active-pixel sensor array on GaAs substrates, and a 16 × 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We will also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self-recognition properties.

Original languageEnglish (US)
Pages (from-to)2-7
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3290
DOIs
StatePublished - Dec 1 1998
Externally publishedYes
EventOptoelectronic Integrated Circuits II - San Jose, CA, United States
Duration: Jan 28 1998Jan 30 1998

Keywords

  • Active-pixel sensor
  • DNA hybridizing
  • Epitaxial growth
  • Epitaxial liftoff
  • Flip-chip bonding
  • Heterogeneous integration
  • MQW modulator
  • Optoelectronics
  • Self-assembly

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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