Free-space parallel multichip interconnection system

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Sadik Esener

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

A parallel data-communication scheme is described for interchip communication with free-space optics. We present a proof-of-concept and feasibility demonstration of a practical modular packaging approach in which free-space optical interconnect modules can be simply integrated on top of an electronic multichip module (MCM). Our packaging architecture is based on a modified folded 4-f imaging system that is implemented with off-the-shelf optics, conventional electronic packaging techniques, and passive assembly techniques to yield a potentially low-cost packaging solution. The prototype system, as built, supports 48 independent free-space channels with eight separate laser and detector chips, in which each chip consists of a one-dimensional array of 12 devices. All chips are assembled on a single ceramic carrier together with three silicon complementary metal-oxide semiconductor chips. Parallel optoelectronic (OE) free-space interconnections are demonstrated at a speed of 200 MHz. The system is compact at only 10 in.3 (∼164 cm3) and is scalable because it can easily accommodate additional chips as well as two-dimensional OE device arrays for increased interconnection density.

Original languageEnglish (US)
Pages (from-to)3516-3524
Number of pages9
JournalApplied Optics
Volume39
Issue number20
StatePublished - Jul 10 2000
Externally publishedYes

Fingerprint

Packaging
chips
Optoelectronic devices
packaging
Space optics
Multichip modules
Electronics packaging
Optical interconnects
Communication
Imaging systems
communication
free-space optical interconnects
electronic modules
optics
Optics
electronic packaging
Demonstrations
Detectors
Silicon
optoelectronic devices

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Zheng, X., Marchand, P. J., Huang, D., & Esener, S. (2000). Free-space parallel multichip interconnection system. Applied Optics, 39(20), 3516-3524.

Free-space parallel multichip interconnection system. / Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Esener, Sadik.

In: Applied Optics, Vol. 39, No. 20, 10.07.2000, p. 3516-3524.

Research output: Contribution to journalArticle

Zheng, X, Marchand, PJ, Huang, D & Esener, S 2000, 'Free-space parallel multichip interconnection system', Applied Optics, vol. 39, no. 20, pp. 3516-3524.
Zheng X, Marchand PJ, Huang D, Esener S. Free-space parallel multichip interconnection system. Applied Optics. 2000 Jul 10;39(20):3516-3524.
Zheng, Xuezhe ; Marchand, Philippe J. ; Huang, Dawei ; Esener, Sadik. / Free-space parallel multichip interconnection system. In: Applied Optics. 2000 ; Vol. 39, No. 20. pp. 3516-3524.
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