Abstract
The 3D-OESP consortium is a government-industry-university collaboration dedicated to the development of the technologies required to integrate stacked silicon chips with optoelectronic devices for high-performance computing and switching applications. By utilizing the combined strengths of 3D chip packaging and optoelectronic array interconnect technologies, it is possible to bring a low-power ultra-compact hardware solution to systems requiring fast processing and handling of large data arrays. We believe that, providing optoelectronic I/O to 3D chip stacks using VCSEL arrays with associated drivers, specially designed optical receivers, and micro-optics to direct the optical signals provide the most efficient way to communicate between the stacks. By integrating these components with a set of packaging techniques ranging from silicon micro-bench to plastic molded lenses, we are presently engaged in demonstrating the practical superiority of this approach in terms of system speed, power and volume metrics. We address various aspects of this approach that are being explored within the 3D-OESP consortium.
| Original language | English (US) |
|---|---|
| Title of host publication | 2000 Southwest Symposium on Mixed-Signal Design, SSMSD 2000 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 7-8 |
| Number of pages | 2 |
| ISBN (Electronic) | 0780359755, 9780780359758 |
| DOIs | |
| State | Published - 2000 |
| Externally published | Yes |
| Event | Southwest Symposium on Mixed-Signal Design, SSMSD 2000 - San Diego, United States Duration: Feb 27 2000 → Feb 29 2000 |
Other
| Other | Southwest Symposium on Mixed-Signal Design, SSMSD 2000 |
|---|---|
| Country | United States |
| City | San Diego |
| Period | 2/27/00 → 2/29/00 |
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ASJC Scopus subject areas
- Signal Processing
- Electrical and Electronic Engineering
Cite this
Free-space optics for 3D multi-chip environment. / Marchand, P.; Esener, Sadik.
2000 Southwest Symposium on Mixed-Signal Design, SSMSD 2000. Institute of Electrical and Electronics Engineers Inc., 2000. p. 7-8 836434.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Free-space optics for 3D multi-chip environment
AU - Marchand, P.
AU - Esener, Sadik
PY - 2000
Y1 - 2000
N2 - The 3D-OESP consortium is a government-industry-university collaboration dedicated to the development of the technologies required to integrate stacked silicon chips with optoelectronic devices for high-performance computing and switching applications. By utilizing the combined strengths of 3D chip packaging and optoelectronic array interconnect technologies, it is possible to bring a low-power ultra-compact hardware solution to systems requiring fast processing and handling of large data arrays. We believe that, providing optoelectronic I/O to 3D chip stacks using VCSEL arrays with associated drivers, specially designed optical receivers, and micro-optics to direct the optical signals provide the most efficient way to communicate between the stacks. By integrating these components with a set of packaging techniques ranging from silicon micro-bench to plastic molded lenses, we are presently engaged in demonstrating the practical superiority of this approach in terms of system speed, power and volume metrics. We address various aspects of this approach that are being explored within the 3D-OESP consortium.
AB - The 3D-OESP consortium is a government-industry-university collaboration dedicated to the development of the technologies required to integrate stacked silicon chips with optoelectronic devices for high-performance computing and switching applications. By utilizing the combined strengths of 3D chip packaging and optoelectronic array interconnect technologies, it is possible to bring a low-power ultra-compact hardware solution to systems requiring fast processing and handling of large data arrays. We believe that, providing optoelectronic I/O to 3D chip stacks using VCSEL arrays with associated drivers, specially designed optical receivers, and micro-optics to direct the optical signals provide the most efficient way to communicate between the stacks. By integrating these components with a set of packaging techniques ranging from silicon micro-bench to plastic molded lenses, we are presently engaged in demonstrating the practical superiority of this approach in terms of system speed, power and volume metrics. We address various aspects of this approach that are being explored within the 3D-OESP consortium.
UR - http://www.scopus.com/inward/record.url?scp=84962016185&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84962016185&partnerID=8YFLogxK
U2 - 10.1109/SSMSD.2000.836434
DO - 10.1109/SSMSD.2000.836434
M3 - Conference contribution
AN - SCOPUS:84962016185
SP - 7
EP - 8
BT - 2000 Southwest Symposium on Mixed-Signal Design, SSMSD 2000
PB - Institute of Electrical and Electronics Engineers Inc.
ER -