Abstract
The direct assembly of objects ranging in size from 100 nm to 10 μm onto electrode arrays fabricated on Si substrates is presented. By configuring electrodes on a host substrate and applying the appropriate potentials, it is possible to move and orient devices over a size ranging from 10-100 nm up to 10-20 μm. This ability to maneuver such a wide range of structures and sizes presents the opportunity to achieve new functionality in a format compatible with standard microelectronics technology.
Original language | English (US) |
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Pages (from-to) | 167-168 |
Number of pages | 2 |
Journal | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS |
Volume | 1 |
State | Published - 1999 |
Externally published | Yes |
Event | Proceedings of the 1999 12th Annual Meeting IEEE Lasers and Electro-Optics Society (LEOS'99) - San Francisco, CA, USA Duration: Nov 8 1999 → Nov 11 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering