Directed assembly of optoelectronic components using electric fields

Donald E. Ackley, Carl F. Edman, Christian Gurtner, Rachel Formosa, Michael (Mike) Heller, James J. Coleman

Research output: Contribution to journalConference article

Abstract

The direct assembly of objects ranging in size from 100 nm to 10 μm onto electrode arrays fabricated on Si substrates is presented. By configuring electrodes on a host substrate and applying the appropriate potentials, it is possible to move and orient devices over a size ranging from 10-100 nm up to 10-20 μm. This ability to maneuver such a wide range of structures and sizes presents the opportunity to achieve new functionality in a format compatible with standard microelectronics technology.

Original languageEnglish (US)
Pages (from-to)167-168
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume1
StatePublished - Dec 1 1999
Externally publishedYes
EventProceedings of the 1999 12th Annual Meeting IEEE Lasers and Electro-Optics Society (LEOS'99) - San Francisco, CA, USA
Duration: Nov 8 1999Nov 11 1999

Fingerprint

Optoelectronic devices
Electric fields
Electrodes
Substrates
Microelectronics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Directed assembly of optoelectronic components using electric fields. / Ackley, Donald E.; Edman, Carl F.; Gurtner, Christian; Formosa, Rachel; Heller, Michael (Mike); Coleman, James J.

In: Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, Vol. 1, 01.12.1999, p. 167-168.

Research output: Contribution to journalConference article

Ackley, Donald E. ; Edman, Carl F. ; Gurtner, Christian ; Formosa, Rachel ; Heller, Michael (Mike) ; Coleman, James J. / Directed assembly of optoelectronic components using electric fields. In: Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. 1999 ; Vol. 1. pp. 167-168.
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