TY - JOUR
T1 - Cyclic voltammetry of dental amalgams
AU - Horasawa, Noriko
AU - Nakajima, Hiroshi
AU - Ferracane, Jack L.
AU - Takahashi, Shigeo
AU - Okabe, Toru
N1 - Funding Information:
This study was supported by NIWNIDR grant DE 07644. The authors wish to thank Tokuriki Honten, Tokyo, Japan, for supplying the alloy powders and Mrs. Jeanne Santa Cruz for her assistance in preparing this manuscript.
PY - 1996
Y1 - 1996
N2 - Objectives. This study used cyclic voltammetry to examine the effect of the composition of dental amalgams on their electrochemical behavior, including reactions occurring outside of oral conditions. Methods. Amalgams (residual mercury 47.5%) were prepared using two low-copper (3 wt% Cu) powders and five high-copper powders (40-80 wt% Ag, 12-30 wt% Cu) with and without zinc (1.5 wt%). Cyclic voltammograms were obtained at 37°C in 1.0% NaCl scanning at 2 mV/s in the potential range from -1.5 V to +0.8 V vs. Ag/AgCl. Results. During the anodic scans, AgCl and Hg2Cl2 films were formed on all amalgams except the one with only 40 wt% Ag. In all high-copper amalgams, a prominent Cu (oxidation) peak was found at -0.1 V. indicating the release of copper during corrosion. Zinc affected the oxidation process for both low- and high-copper amalgams. When zinc was absent, a peak for Sn2+ oxidation appeared at -0.4 V. When zinc was present, a Sn4+ oxidation peak was revealed at -0.6 V. In some amalgams, there was evidence of the selective corrosion (pitting corrosion) of tin and copper. In the lowest silver-content amalgam, no protective films were formed, which is indicative of its poor corrosion resistance. As expected, in all the low-copper amalgams, an extreme increase in current density was recorded immediately at 0 V, due to the release of tin from γ2. Significance. Cyclic voltammetry is useful for the rapid examination (less than an hour) of the electrochemical behavior of amalgams, specifically to obtain information on the formation of compounds and the sequences of electrochemical reactions.
AB - Objectives. This study used cyclic voltammetry to examine the effect of the composition of dental amalgams on their electrochemical behavior, including reactions occurring outside of oral conditions. Methods. Amalgams (residual mercury 47.5%) were prepared using two low-copper (3 wt% Cu) powders and five high-copper powders (40-80 wt% Ag, 12-30 wt% Cu) with and without zinc (1.5 wt%). Cyclic voltammograms were obtained at 37°C in 1.0% NaCl scanning at 2 mV/s in the potential range from -1.5 V to +0.8 V vs. Ag/AgCl. Results. During the anodic scans, AgCl and Hg2Cl2 films were formed on all amalgams except the one with only 40 wt% Ag. In all high-copper amalgams, a prominent Cu (oxidation) peak was found at -0.1 V. indicating the release of copper during corrosion. Zinc affected the oxidation process for both low- and high-copper amalgams. When zinc was absent, a peak for Sn2+ oxidation appeared at -0.4 V. When zinc was present, a Sn4+ oxidation peak was revealed at -0.6 V. In some amalgams, there was evidence of the selective corrosion (pitting corrosion) of tin and copper. In the lowest silver-content amalgam, no protective films were formed, which is indicative of its poor corrosion resistance. As expected, in all the low-copper amalgams, an extreme increase in current density was recorded immediately at 0 V, due to the release of tin from γ2. Significance. Cyclic voltammetry is useful for the rapid examination (less than an hour) of the electrochemical behavior of amalgams, specifically to obtain information on the formation of compounds and the sequences of electrochemical reactions.
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U2 - 10.1016/S0109-5641(96)80014-5
DO - 10.1016/S0109-5641(96)80014-5
M3 - Article
C2 - 9002857
AN - SCOPUS:0030133113
SN - 0109-5641
VL - 12
SP - 154
EP - 160
JO - Dental Materials
JF - Dental Materials
IS - 3
ER -