Critical issues in free space intrachip optical interconnect technology

Michael R. Feldman; Sadik C. Esener; Clark C. Guest; Sing H. Lee

doi:10.1117/12.967549

Critical issues in free space intrachip optical interconnect technology

Michael R. Feldman, Sadik C. Esener, Clark C. Guest, Sing H. Lee

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

Original language	English (US)
Pages (from-to)	336-342
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	836
DOIs	https://doi.org/10.1117/12.967549
State	Published - Jan 1 1987
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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title = "Critical issues in free space intrachip optical interconnect technology",

abstract = "Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.",

author = "Feldman, {Michael R.} and Esener, {Sadik C.} and Guest, {Clark C.} and Lee, {Sing H.}",

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AU - Guest, Clark C.

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N2 - Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

AB - Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

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Critical issues in free space intrachip optical interconnect technology

Abstract

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