Critical issues in free space intrachip optical interconnect technology

Michael R. Feldman, Sadik Esener, Clark C. Guest, Sing H. Lee

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

Original languageEnglish (US)
Pages (from-to)336-342
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume836
DOIs
StatePublished - Jan 1 1987
Externally publishedYes

Fingerprint

free-space optical interconnects
Optical Interconnects
optical interconnects
Optical interconnects
Optical links
packing density
Free Space
scaling
Networks (circuits)
Interconnect
Interconnection
Packing
Scaling

ASJC Scopus subject areas

  • Applied Mathematics
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Computer Science Applications

Cite this

Critical issues in free space intrachip optical interconnect technology. / Feldman, Michael R.; Esener, Sadik; Guest, Clark C.; Lee, Sing H.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 836, 01.01.1987, p. 336-342.

Research output: Contribution to journalArticle

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