Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor

Guoqiang Li, Emel Yuceturk, Dawei Huang, Sadik Esener

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Performance of free-space optical interconnect for the three-dimensional optoelectronic stacked processor (3DOESP) has been analyzed. The wave propagation in the optical interconnection system has been investigated by utilizing rigorous scalar diffraction theory. The effects of ghost talk caused by the superposition of the delayed reflections of the original signal due to the multiple propagation of the wave between the vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) detector have been analyzed. The conducted study indicates that even in the presence of significant amount of ghost talk a high performance free-space optical interconnect can be realized in this system by employing a receiver architecture that allows for DC level adjustment of the signal at the input of the transimpedance amplifier stage.

Original languageEnglish (US)
Pages (from-to)319-329
Number of pages11
JournalOptics Communications
Volume202
Issue number4-6
DOIs
StatePublished - Feb 15 2002
Externally publishedYes

Fingerprint

free-space optical interconnects
Optical interconnects
ghosts
Optoelectronic devices
central processing units
surface emitting lasers
Metal detectors
metals
Semiconductor detectors
wave propagation
receivers
amplifiers
direct current
adjusting
Operational amplifiers
Surface emitting lasers
scalars
Wave propagation
cavities
propagation

Keywords

  • 3D VLSI
  • Optical interconnects
  • Optical switching
  • Optoelectronics
  • VCSELs

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor. / Li, Guoqiang; Yuceturk, Emel; Huang, Dawei; Esener, Sadik.

In: Optics Communications, Vol. 202, No. 4-6, 15.02.2002, p. 319-329.

Research output: Contribution to journalArticle

Li, Guoqiang ; Yuceturk, Emel ; Huang, Dawei ; Esener, Sadik. / Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor. In: Optics Communications. 2002 ; Vol. 202, No. 4-6. pp. 319-329.
@article{55ecaa3aacfe49bda984cb00e06e5c0b,
title = "Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor",
abstract = "Performance of free-space optical interconnect for the three-dimensional optoelectronic stacked processor (3DOESP) has been analyzed. The wave propagation in the optical interconnection system has been investigated by utilizing rigorous scalar diffraction theory. The effects of ghost talk caused by the superposition of the delayed reflections of the original signal due to the multiple propagation of the wave between the vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) detector have been analyzed. The conducted study indicates that even in the presence of significant amount of ghost talk a high performance free-space optical interconnect can be realized in this system by employing a receiver architecture that allows for DC level adjustment of the signal at the input of the transimpedance amplifier stage.",
keywords = "3D VLSI, Optical interconnects, Optical switching, Optoelectronics, VCSELs",
author = "Guoqiang Li and Emel Yuceturk and Dawei Huang and Sadik Esener",
year = "2002",
month = "2",
day = "15",
doi = "10.1016/S0030-4018(01)01735-7",
language = "English (US)",
volume = "202",
pages = "319--329",
journal = "Optics Communications",
issn = "0030-4018",
publisher = "Elsevier",
number = "4-6",

}

TY - JOUR

T1 - Analysis of free-space optical interconnects for the three-dimensional optoelectronic stacked processor

AU - Li, Guoqiang

AU - Yuceturk, Emel

AU - Huang, Dawei

AU - Esener, Sadik

PY - 2002/2/15

Y1 - 2002/2/15

N2 - Performance of free-space optical interconnect for the three-dimensional optoelectronic stacked processor (3DOESP) has been analyzed. The wave propagation in the optical interconnection system has been investigated by utilizing rigorous scalar diffraction theory. The effects of ghost talk caused by the superposition of the delayed reflections of the original signal due to the multiple propagation of the wave between the vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) detector have been analyzed. The conducted study indicates that even in the presence of significant amount of ghost talk a high performance free-space optical interconnect can be realized in this system by employing a receiver architecture that allows for DC level adjustment of the signal at the input of the transimpedance amplifier stage.

AB - Performance of free-space optical interconnect for the three-dimensional optoelectronic stacked processor (3DOESP) has been analyzed. The wave propagation in the optical interconnection system has been investigated by utilizing rigorous scalar diffraction theory. The effects of ghost talk caused by the superposition of the delayed reflections of the original signal due to the multiple propagation of the wave between the vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) detector have been analyzed. The conducted study indicates that even in the presence of significant amount of ghost talk a high performance free-space optical interconnect can be realized in this system by employing a receiver architecture that allows for DC level adjustment of the signal at the input of the transimpedance amplifier stage.

KW - 3D VLSI

KW - Optical interconnects

KW - Optical switching

KW - Optoelectronics

KW - VCSELs

UR - http://www.scopus.com/inward/record.url?scp=0037083331&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037083331&partnerID=8YFLogxK

U2 - 10.1016/S0030-4018(01)01735-7

DO - 10.1016/S0030-4018(01)01735-7

M3 - Article

AN - SCOPUS:0037083331

VL - 202

SP - 319

EP - 329

JO - Optics Communications

JF - Optics Communications

SN - 0030-4018

IS - 4-6

ER -